American Journal of Materials Science

American Journal of Materials Science publishes reviews, full-length papers, and short communications recording original research results on, or techniques for studying the relationship between structure, properties, and uses of materials.


Li Ngee Ho

Editorial Board Member of American Journal of Materials Science

Post-doctoral Fellow, Osaka University, Japan

Research Areas

Electrically Conductive Adhesive, Porous Materials, Rare Earth Phosphate

Education

2003–2006Ph.DOita University, Japan
2002–2003Research studentOita University, Japan
1996–1999BScUniversity Science Malaysia

Experience

November 2011-CurrentPostdoctoral Fellow, Joining and Welding Research Institute, Osaka University, Japan.
June 2009-CurrentSenior Lecturer, Material Engineering, School of Materials Engineering, University Malaysia Perlis.
October 2007-March 2009Postdoctoral Researcher, Electrically Conductive Adhesive, Smart Processing Research Center, Joining and Welding Research Institute, Osaka University, Japan.
May 2007-September 2007Visiting Researcher, Luminescent Properties of Phosphate Phosphor , Graduate School of Science and Technology, Niigata University, Japan.
June 2006-March 2007Lecturer, Material Engineering, School of Materials Engineering, Northern Malaysia University College of Engineering.
February 2000-February 2002Process Engineer, QDOS Flexcircuits (M) Pte. Ltd., Malaysia.
June 1999-January 2000Quality Control Engineer, Asia Printed Circuits (M) Pte. Ltd., Malaysia.

Membership

Associate Member of Malaysia Institute of Chemistry (2011~Current)
Member of Japan Institute of Electronics Packaging (2008 - 2009)
Member of Catalyst Society of Japan (2005 - 2006)
Member of Chemistry Society of Japan (2003 - 2004)

Publications: Journals

[1]  Li-Ngee Ho, Tatsumi Ishihara, Hiroyasu Nishiguchi, Yusaku Takita, ‘Removal of fluoride from water through ion exchange by mesoporous Ti oxohydroxide’, Journal of Colloid and Interface Science (2004) Vol. 272, 399-403.
[2]  Li-Ngee Ho, Tasuku Ikegawa, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Synthesis and characterization of molybdenum incorporated mesoporous aluminophoshate’, Applied Surface Science, (2006) Vol. 252, 6260-6268.
[3]  Li-Ngee Ho, Shiro Yukushima, Rie Morikawa, Naoko Asaka, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Synthesis of a thermally stable mesoporous aluminophosphate by using sodium aluminate as precursor’, Colloids and Surfaces A: Physicochemical and Engineering Aspects (2005) Vol. 268, 40-44.
[4]  Li-Ngee Ho, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Preparation of mesoporous nanocrystalline cerium phosphate with controllable pore size by using chelating agent’, Materials Chemistry and Physics (2006) Vol. 97, 494-500.
[5]  Li-Ngee Ho, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Synthesis and characterization of a series of mesoporous lanthanide phosphate’, Journal of Porous Materials (2006) Vol.13, 237-244.
[6]  Li-Ngee Ho, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Synthesis and characterization of nanocrystalline mesoporous lanthanum phosphate’, Journal of Rare Earths (2007) Vol. 25, 684-691.
[7]  Ho Li Ngee, Nishikawa Hiroshi, Natsume Naohide, Takemoto Tadashi, ‘The electrical property of copper and copper alloy particles containing electrically conductive adhesives’, Transactions of JWRI (2008) Vol.37, 69-73.
[8]  Ho Li Ngee, Tomoki Hatsumori, Kazuyoshi Uematsu, Tadashi Ishigaki, Kenji Toda, Mineo Sato, “Synthesis of phosphate phosphor for a white LED”, Physics Procedia (2009) Vol. 2, 171-183.
[9]  Li-Ngee Ho, Hiroshi Nishikawa, Natsume Naohide, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota, “Effects of trace elements in copper fillers on the electrical properties of conductive adhesives” Journal of Electronic Materials (2010) Vol. 39, 115-123.
[10]  Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa, Tadashi Takemoto, ‘Electrical Properties of Pre-Alloyed Cu-P containing Electrically Conductive Adhesive’, Journal of Adhesion (2010) Vol.86, 805-813.
[11]  Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto, ‘Effect of Different Copper Fillers on The Electrical Resistivity of Conductive Adhesives’, Journal of Material Science: Materials in Electronics (2011) Vol. 22, 538-544.
[12]  Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, Koyu Ota, ‘Electrical Reliability of Different Alloying Content on Copper Alloy Fillers in Electrically Conductive Adhesives’, Journal of Material Science: Materials in Electronics (In Press).

Publications: Conferences/Workshops/Symposiums

[1]  i-Ngee Ho, Tatsumi Ishihara, Hiroyasu Nishiguchi, Yusaku Takita, ‘Fluoride ion exchange by mesoporous Ti(OH)4’, 83rd Annual Meeting of Chemistry Society of Japan (18th- 21st March 2003), Waseda University, Tokyo,Japan.
[2]  Li-Ngee Ho, Tasuku Ikegawa, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Synthesis and characterization of molybdenum incorporated mesoporous aluminophoshate’, The Chemistry Conference of Western Japan (30-31st October 2004), Oita University, Oita, Japan.
[3]  Li-Ngee Ho, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Synthesis of a series of mesoporous rare earth phosphate’, 95th Annual Meeting of Catalyst Society of Japan (30-31st March 2005),Tokyo Institute of Technology, Tokyo, Japan.
[4]  Li-Ngee Ho, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Synthesis and characterization of a series of mesoporous lanthanide phosphate’, Proceeding of 3rd International Conference on Materials for Advanced Technologies (ICMAT August 3-8th, 2005) in Singapore.
[5]  Li-Ngee Ho, Hiroyasu Nishiguchi, Katsutoshi Nagaoka, Yusaku Takita, ‘Synthesis and characterization of mesoporous lanthanum phosphate through carboxylic acid route’, Proceeding of The International Chemical Congress of Pacific Basin Societies (Pacifichem 2005) in Honolulu, Hawaii.
[6]  Li-Ngee Ho, Tatsumi Ishihara, Hiroyasu Nishiguchi, Yusaku Takita, ‘Fluoride ion exchange properties of mesoporous titanium-oxo-hydroxide’, Proceeding of the International Conference on Science and Technology (ICSTIE, 8-9th December 2006) UiTM, Penang, Malaysia.
[7]  T. Hatsumori, Li-Ngee Ho, K. Uematsu, K. Toda and M. Sato, ‘Fabrication of a blue phosphate phosphor for use in a white LED’, Annual Meeting of the Ceramic Society of Japan, (16 - 18 March 2008), Tokyo University of Science, Tokyo, Japan.
[8]  T. Hatsumori, Li-Ngee Ho, K. Uematsu, K. Toda and M. Sato, ‘Synthesis of phosphate phosphor for a white LED’, Proceeding of the 15th International Conference on Luminescence and Optical Spectroscopy of Condensed Matter (ICL ’08, 7-11 July 2008), Lyon, France.
[9]  Hiroshi Nishikawa, Li-Ngee Ho, Tadashi Takemoto, Yukiyasu Kashiwagi, Mari Yamamoto and Masami Nakamoto, ‘Electrical property of conductive adhesive using Cu nanoparticles with organic layer’, Proceeding of the 83rd National Meeting of Japan Welding Society (10-12th September 2008) Kitakyushu International Conference Center, Fukuoka, Japan.
[10]   Li-Ngee Ho, Hiroshi Nishikawa, Natsume Naohide, Tadashi Takemoto, ‘Evaluation of Electrically Conductive Adhesive Containing Copper Particles with Oxidation Prevention’, Proceeding of the 18th Micro-Electronics Symposium (MES 2008, 18-19th September 2008) Kyoto University, Kyoto, Japan.
[11]  Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto, Yukiyasu Kashiwagi, Mari Yamamoto, Masami Nakamoto, ‘A Thermally Stable Electrically Conductive Adhesives Filled with Organic Layer Protected Copper Nanoparticles’, 23rd Annual Meeting of Japan Institute of Electronic Packaging (JIEP Jisso 2009, 11-13rd March 2009) Kanto Gakuin University, Yokohama, Japan.
[12]  Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto, Yukiyasu Kashiwagi, Mari Yamamoto, Masami Nakamoto, ‘Characteristics of Electrically Conductive Adhesives Filled with Copper Nanoparticles with Organic Layer’, 17th European Microelectronics and Packaging Conference and Exhibition (EMPC 2009, 15-18th June 2009) Rimini, Italy.
[13]  Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto, ‘Electrical Properties and Thermal Stability of Cu-P Containing Electrically Conductive Adhesives’, Malaysian Metallurgical Conference 2009 (MMC 2009,1st & 2nd Dec 2009) Kuala Perlis, Perlis, Malaysia.
[14]  Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto, ‘Copper Alloy Filled Electrically Conductive Adhesives’, 10th National Symposium On Polymeric Materials 2010 (NSPM 2010, 8-10th Nov 2010) Langkawi, Kedah, Malaysia.
[15]  Li-Ngee Ho, Hiroshi Nishikawa, Tadashi Takemoto, ‘Effect of Cu Morphology on Electrical Resistivity of Electrically Conductive Adhesive”, 2nd ASEAN-APCTP Workshop on Advanced Materials Science and Nanotechnology 2010 (AMSN 2010, 21-23rd Dec 2010) Tanjong Bungah, Penang, Malaysia.
[16]  Li-Ngee Ho, Pei-Ing Chua, Hakimah Osman, Soon-An Ong, ‘Photocatalytic Degradation of Dye by Titania Loaded Biomaterials under Solar Light’, 14th Asian Chemical Congress 2011, Contemporary Chemistry for Sustainability and Economic Sufficiency (14th ACC 2011, 5-8 September 2011) Bangkok, Thailand.